Chipsmall X-Ray Inspection for Electronic Components Is Opening Now

X-ray inspection is to use X-ray imaging technology to obtain the internal structure of the test object, and then observe the internal information of the test object without breaking the test object.

It is mainly used for authenticity judgment and failure analysis of components. It is an internationally recognized method for chip authenticity judgment and fault analysis and detection.

X-ray detection technology has the advantages of fast speed, non-destructive and low cost in chip authenticity detection.

Chip failure detection:

Through X-ray pictures, visually observe the internal defects, peeling, bursting, voids, etc. of the chip, and assist in judging the chip failure.

Chip authenticity judgment:

The authenticity can be judged by comparing the frame, grain, lead wire and other elements in the x-ray diagram of the test piece with the standard chip;